Assignee
DESIGNER MOLECULES INC
US·22 granted patents·21 pending applications·421 citations·filing 2004–2025
Top patents by PatentIndex Score
43 records- 0199US7678879B2Adhesive composition of phenol-functional polyamidesDESIGNER MOLECULES INC·Filed 2006·Granted Mar 16, 2010·50 cites·4 claims
- 0298US7285613B2Free-radical curable polyesters and methods for use thereofDESIGNER MOLECULES INC·Filed 2005·Granted Oct 23, 2007·41 cites·6 claims
- 0397US7208566B2Imide-linked maleimide and polymaleimide compoundsDESIGNER MOLECULES INC·Filed 2004·Granted Apr 24, 2007·66 cites·9 claims
- 0496US7928153B2Thermosetting polyether oligomers, compositions and methods for use thereofDESIGNER MOLECULES INC·Filed 2008·Granted Apr 19, 2011·23 cites·41 claims
- 0596US7875688B2Free-radical curable polyesters and methods for use thereofDESIGNER MOLECULES INC·Filed 2007·Granted Jan 25, 2011·17 cites·19 claims
- 0696US7157587B2Imide-extended liquid bismaleimide resinDESIGNER MOLECULES INC·Filed 2004·Granted Jan 2, 2007·60 cites·16 claims
- 0794US8039663B2Monomers derived from pentacyclopentadecane dimethanolDESIGNER MOLECULES INC·Filed 2008·Granted Oct 18, 2011·12 cites·19 claims
- 0894US8008419B2Siloxane monomers and methods for use thereofDESIGNER MOLECULES INC·Filed 2009·Granted Aug 30, 2011·15 cites·19 claims
- 0993US7884174B2Imide-linked maleimide and polymaleimide compoundsDESIGNER MOLECULES INC·Filed 2007·Granted Feb 8, 2011·16 cites·21 claims
- 1093US7786234B2Free-radical curable polyesters and methods for use thereofDESIGNER MOLECULES INC·Filed 2007·Granted Aug 31, 2010·17 cites·13 claims
- 1192US8013104B2Thermosetting hyperbranched compositions and methods for use thereofDESIGNER MOLECULES INC·Filed 2009·Granted Sep 6, 2011·11 cites·18 claims
- 1292US7777064B2Adhesive compositions containing cyclic siloxanes and methods for use thereofDESIGNER MOLECULES INC·Filed 2006·Granted Aug 17, 2010·28 cites·10 claims
- 1391US2026071103A1Anionic Curable CompositionsDESIGNER MOLECULES INC·Filed 2025·Application pending·0 cites
- 1491US2026071104A1Anionic Curable CompositionsDESIGNER MOLECULES INC·Filed 2025·Application pending·0 cites
- 1588US7868113B2Low shrinkage polyester thermosetting resinsDESIGNER MOLECULES INC·Filed 2007·Granted Jan 11, 2011·15 cites·23 claims
- 1687US8710682B2Materials and methods for stress reduction in semiconductor wafer passivation layersDESIGNER MOLECULES INC·Filed 2013·Granted Apr 29, 2014·8 cites·22 claims
- 1783US7795362B2Olefin oligomers containing pendant maleimide groupsDESIGNER MOLECULES INC·Filed 2005·Granted Sep 14, 2010·10 cites·43 claims
- 1882US8043534B2Maleimide compositions and methods for use thereofDESIGNER MOLECULES INC·Filed 2007·Granted Oct 25, 2011·11 cites·13 claims
- 1980US8344076B2Hydrolytically resistant thermoset monomersDESIGNER MOLECULES INC·Filed 2007·Granted Jan 1, 2013·3 cites·24 claims
- 2079US7786248B2Underfill compositions and methods for use thereofDESIGNER MOLECULES INC·Filed 2005·Granted Aug 31, 2010·12 cites·16 claims
- 2175US7863346B2Mold compositions with high adhesion to metal substratesDESIGNER MOLECULES INC·Filed 2006·Granted Jan 4, 2011·3 cites·11 claims
- 2270US8378017B2Thermosetting adhesive compositionsDESIGNER MOLECULES INC·Filed 2006·Granted Feb 19, 2013·2 cites·11 claims
- 2368US7825188B2Thermoplastic elastomer with acyloxyphenyl hard block segmentDESIGNER MOLECULES INC·Filed 2007·Granted Nov 2, 2010·1 cites·17 claims
- 2468US2018237668A1Anionic curable compositionsDESIGNER MOLECULES INC·Filed 2016·Application pending·0 cites
- 2565US9278909B2Amide-extended crosslinking compounds and methods for use thereofDESIGNER MOLECULES INC·Filed 2013·Granted Mar 8, 2016·0 cites·1 claims
- 2659US2010056671A1Polyfunctional epoxy oligomersDESIGNER MOLECULES INC·Filed 2008·Application pending·0 cites
- 2759US2023143643A1Low dk copper clad laminate compositionsDESIGNER MOLECULES INC·Filed 2020·Application pending·0 cites
- 2858US2013313489A1Soluble metal salts for use as conductivity promotersDESIGNER MOLECULES INC·Filed 2013·Application pending·0 cites
- 2958US2013299747A1Curatives for epoxy compositionsersDESIGNER MOLECULES INC·Filed 2013·Application pending·0 cites
- 3058US2014275413A1Heat and moisture resistant anaerobic adhesives and sealantsDESIGNER MOLECULES INC·Filed 2014·Application pending·0 cites
- 3154US2010113643A1Curatives for epoxy adhesive compositionsDESIGNER MOLECULES INC·Filed 2008·Application pending·0 cites
- 3251US2014020827A1Anti-bleed compounds, compositions and methods for use thereofDESIGNER MOLECULES INC·Filed 2013·Application pending·0 cites
- 3349US2013199724A1Curatives for epoxy compositionsDESIGNER MOLECULES INC·Filed 2013·Application pending·0 cites
- 3449US2013203895A1Curing agents for epoxy resinsDESIGNER MOLECULES INC·Filed 2013·Application pending·0 cites
- 3549US2014272435A1Anti-stick surface coatingsDESIGNER MOLECULES INC·Filed 2013·Application pending·0 cites
- 3648US2023095931A1Uv-curable resin compositions suitable for redistribution layersDESIGNER MOLECULES INC·Filed 2021·Application pending·0 cites
- 3744US2013012620A1Curing agents for epoxy resinsDESIGNER MOLECULES INC·Filed 2011·Application pending·0 cites
- 3843US2015344627A1Low modulus negative tone, aqueous developable photoresistDESIGNER MOLECULES INC·Filed 2013·Application pending·0 cites
- 3942US2022213267A1Extreme high temperature stable adhesives and coatingsDESIGNER MOLECULES INC·Filed 2020·Application pending·0 cites
- 4041US2022204696A1Phenolic functionalized polyimides and compositions thereofDESIGNER MOLECULES INC·Filed 2020·Application pending·0 cites
- 4140US2021301133A1Curable polyimidesDESIGNER MOLECULES INC·Filed 2018·Application pending·0 cites
- 4240US2022204766A1High molecular weight flexible curable polyimidesDESIGNER MOLECULES INC·Filed 2020·Application pending·0 cites
- 4337US2013187095A1Thermosetting adhesive compositionsDESIGNER MOLECULES INC·Filed 2013·Application pending·0 cites
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