Assignee
DENSE PAC MICROSYSTEMS INC
US·8 granted patents·1,899 citations·filing 1988–2001
Top patents by PatentIndex Score
8 records- 0198US6404043B1Panel stacking of BGA devices to form three-dimensional modulesDENSE PAC MICROSYSTEMS INC·Filed 2000·Granted Jun 11, 2002·263 cites·20 claims
- 0297US5612570AChip stack and method of making sameDENSE PAC MICROSYSTEMS INC·Filed 1995·Granted Mar 18, 1997·341 cites·18 claims
- 0397US4956694AIntegrated circuit chip stackingDENSE PAC MICROSYSTEMS INC·Filed 1988·Granted Sep 11, 1990·398 cites·25 claims
- 0495US6323060B1Stackable flex circuit IC package and method of making sameDENSE PAC MICROSYSTEMS INC·Filed 1999·Granted Nov 27, 2001·146 cites·5 claims
- 0594US5313096AIC chip package having chip attached to and wire bonded within an overlying substrateDENSE PAC MICROSYSTEMS INC·Filed 1992·Granted May 17, 1994·217 cites·19 claims
- 0692US6222737B1Universal package and method of forming the sameDENSE PAC MICROSYSTEMS INC·Filed 1999·Granted Apr 24, 2001·135 cites·17 claims
- 0791US6627984B2Chip stack with differing chip package typesDENSE PAC MICROSYSTEMS INC·Filed 2001·Granted Sep 30, 2003·101 cites·15 claims
- 0891US5869353AModular panel stacking processDENSE PAC MICROSYSTEMS INC·Filed 1997·Granted Feb 9, 1999·298 cites·6 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →