Assignee
DECA TECH USA INC
US·27 granted patents·17 pending applications·9 citations·filing 2021–2025
Top patents by PatentIndex Score
44 records- 0194US12205881B2Semiconductor assembly comprising a 3D block and method of making the sameDECA TECH USA INC·Filed 2023·Granted Jan 21, 2025·2 cites·30 claims
- 0293US11616003B2Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnectsDECA TECH USA INC·Filed 2022·Granted Mar 28, 2023·2 cites·18 claims
- 0391US12424527B2Multi-chip or multi-chiplet fan-out device for laminate and leadframe packagesDECA TECH USA INC·Filed 2024·Granted Sep 23, 2025·1 cites·27 claims
- 0490US11444051B2Fully molded semiconductor structure with face mounted passives and method of making the sameDECA TECH USA INC·Filed 2021·Granted Sep 13, 2022·2 cites·20 claims
- 0589US2026068721A13d block attached to a substrate in a semiconductor packageDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 0688US11728248B2Fully molded semiconductor structure with through silicon via (TSV) vertical interconnectsDECA TECH USA INC·Filed 2022·Granted Aug 15, 2023·1 cites·20 claims
- 0788US2026040919A1Fully molded semiconductor structure with through silicon via (tsv) vertical interconnectsDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 0888US2025391814A1Method of making a fan-out semiconductor assembly with an intermediate carrierDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 0987US11887862B2Method for redistribution layer (RDL) repair by mitigating at least one defect with a custom RDLDECA TECH USA INC·Filed 2022·Granted Jan 30, 2024·1 cites·20 claims
- 1086US2025357351A1Fully molded bridge interposer and method of making the sameDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 1183US2025336888A1Method of making a fan-out semiconductor assembly with an intermediate carrierDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 1281US12362322B2Method of making a fan-out semiconductor assembly with an intermediate carrierDECA TECH USA INC·Filed 2024·Granted Jul 15, 2025·0 cites·21 claims
- 1379US2025308993A1Unit specific variable or adaptive metal fill and system and method for the sameDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 1477US12438065B2Fully molded semiconductor structure with through silicon via (TSV) vertical interconnectsDECA TECH USA INC·Filed 2023·Granted Oct 7, 2025·0 cites·26 claims
- 1576US12469776B2Semiconductor assembly comprising a 3D block and method of making the sameDECA TECH USA INC·Filed 2025·Granted Nov 11, 2025·0 cites·20 claims
- 1675US12334396B2Unit specific variable or adaptive metal fill and system and method for the sameDECA TECH USA INC·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 1774US12381154B2Fully molded bridge interposer and method of making the sameDECA TECH USA INC·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 1874US12300561B2Fully molded structure with multi-height components comprising backside conductive material and method for making the sameDECA TECH USA INC·Filed 2024·Granted May 13, 2025·0 cites·21 claims
- 1973US2025372395A1EMBEDDED COMPONENT INTERPOSER OR SUBSTRATE COMPRISING DISPLACEMENT COMPENSATION TRACES (DCTs) AND METHOD OF MAKING THE SAMEDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 2073US2024421051A1Multi-chip or multi-chiplet fan-out device for laminate and leadframe packagesDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 2172US2025273526A1Fully molded structure with multi-height components comprising backside conductive material and method for making the sameDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 2271US12519053B2Lot of devices with repairable redistribution layer (RDL) design with a custom RDLDECA TECH USA INC·Filed 2024·Granted Jan 6, 2026·0 cites·21 claims
- 2370US12424450B2Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the sameDECA TECH USA INC·Filed 2024·Granted Sep 23, 2025·0 cites·24 claims
- 2470US11791207B2Unit specific variable or adaptive metal fill and system and method for the sameDECA TECH USA INC·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
- 2570US11538759B2Fully molded bridge interposer and method of making the sameDECA TECH USA INC·Filed 2022·Granted Dec 27, 2022·0 cites·20 claims
- 2669US12057373B2Stackable fully molded semiconductor structure with through silicon via (TSV) vertical interconnects and method of making the sameDECA TECH USA INC·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
- 2768US12170261B2Molded direct contact interconnect structure without capture pads and method for the sameDECA TECH USA INC·Filed 2023·Granted Dec 17, 2024·0 cites·30 claims
- 2868US11973051B2Molded direct contact interconnect structure without capture pads and method for the sameDECA TECH USA INC·Filed 2023·Granted Apr 30, 2024·0 cites·30 claims
- 2964US2026101777A1Molded layered bridge and method of making the sameDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 3063US12506102B2Fully molded semiconductor structure with face mounted passives and method of making the sameDECA TECH USA INC·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
- 3163US12500197B2Encapsulant-defined land grid array (LGA) package and method for making the sameDECA TECH USA INC·Filed 2023·Granted Dec 16, 2025·0 cites·22 claims
- 3262US2024404840A1Molded direct contact interconnect substrate and methods of making sameDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 3362US2024395673A1Stackable fully molded semiconductor structure with through vertical interconnectsDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 3461US12261140B2Stackable fully molded semiconductor structure with vertical interconnectsDECA TECH USA INC·Filed 2021·Granted Mar 25, 2025·0 cites·19 claims
- 3560US2025112141A1Quad flat no-lead (qfn) package without leadframe and with layer of dielectricDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 3659US12062550B2Molded direct contact interconnect substrate and methods of making sameDECA TECH USA INC·Filed 2023·Granted Aug 13, 2024·0 cites·28 claims
- 3759US2025054785A1Method of selective release of components using thermal release layerDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 3859US2024243089A1Layered molded direct contact and dielectric structure and method for making the sameDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 3957US2026011574A1Interconnect substrate and method of makingDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 4057US2024030174A1Quad flat no-lead (qfn) package with backside conductive material and direct contact interconnect build-up structure and method for making the sameDECA TECH USA INC·Filed 2023·Application pending·0 cites
- 4156US12593703B2Molded bridge with vertical interconnects and method of making the sameDECA TECH USA INC·Filed 2025·Granted Mar 31, 2026·0 cites·21 claims
- 4254US11749534B1Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the sameDECA TECH USA INC·Filed 2022·Granted Sep 5, 2023·0 cites·29 claims
- 4352US11664321B2Multi-step high aspect ratio vertical interconnect and method of making the sameDECA TECH USA INC·Filed 2022·Granted May 30, 2023·0 cites·19 claims
- 4451US12500198B2Quad flat no-lead (QFN) package with tie bars and direct contact interconnect build-up structure and method for making the sameDECA TECH USA INC·Filed 2025·Granted Dec 16, 2025·0 cites·23 claims
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