Individual holder
CORISIS DAVID J
US·16 granted patents·7 pending applications·187 citations·filing 2005–2012
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
23 records- 0198US8106491B2Methods of forming stacked semiconductor devices with a leadframe and associated assembliesCORISIS DAVID J·Filed 2007·Granted Jan 31, 2012·66 cites·19 claims
- 0297US8450839B2Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devicesCORISIS DAVID J·Filed 2010·Granted May 28, 2013·36 cites·8 claims
- 0393US8115112B2Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substratesCORISIS DAVID J·Filed 2008·Granted Feb 14, 2012·22 cites·30 claims
- 0491US8426743B2Electronic device assemblies including conductive vias having two or more conductive elementsCORISIS DAVID J·Filed 2010·Granted Apr 23, 2013·10 cites·17 claims
- 0591US8067827B2Stacked microelectronic device assembliesCORISIS DAVID J·Filed 2007·Granted Nov 29, 2011·16 cites·12 claims
- 0687US8138021B2Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor componentsCORISIS DAVID J·Filed 2010·Granted Mar 20, 2012·9 cites·21 claims
- 0787US8125092B2Semiconductor device packages and assembliesCORISIS DAVID J·Filed 2008·Granted Feb 28, 2012·15 cites·22 claims
- 0875US8178984B2Flip chip with interposerCORISIS DAVID J·Filed 2010·Granted May 15, 2012·3 cites·13 claims
- 0972US8445997B2Stacked packaged integrated circuit devicesCORISIS DAVID J·Filed 2012·Granted May 21, 2013·2 cites·10 claims
- 1071US9673121B2Carrierless chip package for integrated circuit devices, and methods of making sameCORISIS DAVID J·Filed 2008·Granted Jun 6, 2017·3 cites·25 claims
- 1166US8735183B2System in package (SIP) with dual laminate interposersCORISIS DAVID J·Filed 2007·Granted May 27, 2014·1 cites·16 claims
- 1264US8072055B2High density stacked die assemblies, structures incorporated therein and methods of fabricating the assembliesCORISIS DAVID J·Filed 2009·Granted Dec 6, 2011·2 cites·22 claims
- 1361USRE43112EStackable ball grid array packageCORISIS DAVID J·Filed 2006·Granted Jan 17, 2012·2 cites·26 claims
- 1454US8587109B2Stacked microelectronic dies and methods for stacking microelectronic diesCORISIS DAVID J·Filed 2011·Granted Nov 19, 2013·0 cites·19 claims
- 1553US2006186533A1Chip scale package with heat spreaderCORISIS DAVID J·Filed 2006·Application pending·0 cites
- 1652US8441132B2Packaged microelectronic devices recessed in support member cavities, and associated methodsCORISIS DAVID J·Filed 2012·Granted May 14, 2013·0 cites·21 claims
- 1752US2005248038A1Chip scale package with heat spreaderCORISIS DAVID J·Filed 2005·Application pending·0 cites
- 1851US2006118924A1Lead frame assemblies and decoupling capacitorsCORISIS DAVID J·Filed 2006·Application pending·0 cites
- 1950US8202754B2Packaged microelectronic devices recessed in support member cavities, and associated methodsCORISIS DAVID J·Filed 2006·Granted Jun 19, 2012·0 cites·42 claims
- 2050US2007216033A1Carrierless chip package for integrated circuit devices, and methods of making sameCORISIS DAVID J·Filed 2006·Application pending·0 cites
- 2147US2006154404A1Die paddle clamping method for wire bond enhancementCORISIS DAVID J·Filed 2005·Application pending·0 cites
- 2245US2009091009A1Stackable integrated circuit packageCORISIS DAVID J·Filed 2007·Application pending·0 cites
- 2341US2006284301A1CSP semiconductor chip and BGA assembly with enhanced physical protection, protective members and assemblies used with same, and methods of enhancing physical protection of chips and assembliesCORISIS DAVID J·Filed 2005·Application pending·0 cites
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