Assignee
COMPONENT RE ENGINEERING COMPANY INC
US·5 granted patents·1 pending application·20 citations·filing 2012–2014
Top patents by PatentIndex Score
6 records- 0187US8684256B2Method for hermetically joining plate and shaft devices including ceramic materials used in semiconductor processingCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Apr 1, 2014·7 cites·10 claims
- 0286US9624137B2Low temperature method for hermetically joining non-diffusing ceramic materialsCOMPONENT RE-ENGINEERING COMPANY INC·Filed 2014·Granted Apr 18, 2017·6 cites·26 claims
- 0386US8789743B2Hermetically joined ceramic assemblies and low temperature method for hermetically joining ceramic materialsCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Jul 29, 2014·5 cites·19 claims
- 0469US9556074B2Method for manufacture of a multi-layer plate deviceCOMPONENT RE-ENGINEERING COMPANY INC·Filed 2012·Granted Jan 31, 2017·1 cites·23 claims
- 0569US9315424B2Multi-layer plate deviceCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Apr 19, 2016·1 cites·19 claims
- 0640US2013250471A1Compressible conductive element for use in current-carrying structureCOMPONENT RE ENGINEERING COMPANY INC·Filed 2013·Application pending·0 cites
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