Assignee
CHO NAMJU
KR·10 granted patents·1 pending application·247 citations·filing 2009–2011
Top patents by PatentIndex Score
11 records- 0198US8264091B2Integrated circuit packaging system with encapsulated via and method of manufacture thereofCHO NAMJU·Filed 2009·Granted Sep 11, 2012·95 cites·20 claims
- 0297US9496152B2Carrier system with multi-tier conductive posts and method of manufacture thereofCHO NAMJU·Filed 2010·Granted Nov 15, 2016·42 cites·20 claims
- 0397US8318539B2Method of manufacture of integrated circuit packaging system with multi-tier conductive interconnectsCHO NAMJU·Filed 2011·Granted Nov 27, 2012·37 cites·10 claims
- 0496US8390108B2Integrated circuit packaging system with stacking interconnect and method of manufacture thereofCHO NAMJU·Filed 2009·Granted Mar 5, 2013·47 cites·19 claims
- 0586US8476111B2Integrated circuit packaging system with intra substrate die and method of manufacture thereofCHO NAMJU·Filed 2011·Granted Jul 2, 2013·8 cites·10 claims
- 0681US8541872B2Integrated circuit package system with package stacking and method of manufacture thereofCHO NAMJU·Filed 2010·Granted Sep 24, 2013·6 cites·20 claims
- 0780US8564125B2Integrated circuit packaging system with embedded thermal heat shield and method of manufacture thereofCHO NAMJU·Filed 2011·Granted Oct 22, 2013·5 cites·18 claims
- 0877US8389329B2Integrated circuit packaging system with package stacking and method of manufacture thereofCHO NAMJU·Filed 2011·Granted Mar 5, 2013·4 cites·20 claims
- 0971US9355939B2Integrated circuit package stacking system with shielding and method of manufacture thereofCHO NAMJU·Filed 2010·Granted May 31, 2016·3 cites·20 claims
- 1048US2010244223A1Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereofCHO NAMJU·Filed 2009·Application pending·0 cites
- 1142US9054098B2Integrated circuit packaging system with redistribution layer and method of manufacture thereofCHO NAMJU·Filed 2011·Granted Jun 9, 2015·0 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →