Assignee
CHIPMOS TECHNOLOGIES BERMUDA
BM·25 granted patents·15 pending applications·300 citations·filing 2002–2009
Top patents by PatentIndex Score
40 records- 0188US7662672B2Manufacturing process of leadframe-based BGA packagesCHIPMOS TECHNOLOGIES BERMUDA·Filed 2008·Granted Feb 16, 2010·20 cites·19 claims
- 0288US7372286B2Modular probe cardCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Granted May 13, 2008·17 cites·6 claims
- 0388US6853205B1Probe card assemblyCHIPMOS TECHNOLOGIES BERMUDA·Filed 2003·Granted Feb 8, 2005·41 cites·9 claims
- 0485US7554197B2High frequency IC package and method for fabricating the sameCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Granted Jun 30, 2009·14 cites·12 claims
- 0585US7420267B2Image sensor assembly and method for fabricating the sameCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Granted Sep 2, 2008·9 cites·7 claims
- 0685US6703075B1Wafer treating method for making adhesive diesCHIPMOS TECHNOLOGIES BERMUDA·Filed 2002·Granted Mar 9, 2004·37 cites·16 claims
- 0779US6686615B1Flip-chip type semiconductor device for reducing signal skewCHIPMOS TECHNOLOGIES BERMUDA·Filed 2002·Granted Feb 3, 2004·35 cites·5 claims
- 0879US6621710B1Modular probe card assemblyCHIPMOS TECHNOLOGIES BERMUDA·Filed 2002·Granted Sep 16, 2003·29 cites·1 claims
- 0978US7170160B1Chip structure and stacked-chip packageCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Granted Jan 30, 2007·14 cites·13 claims
- 1075US8030767B2Bump structure with annular supportCHIPMOS TECHNOLOGIES BERMUDA·Filed 2007·Granted Oct 4, 2011·6 cites·10 claims
- 1174US7952198B2BGA package with leads on chipCHIPMOS TECHNOLOGIES BERMUDA·Filed 2008·Granted May 31, 2011·7 cites·20 claims
- 1273US7741149B2Method of fabricating chip package structureCHIPMOS TECHNOLOGIES BERMUDA·Filed 2009·Granted Jun 22, 2010·6 cites·9 claims
- 1370US7879653B2Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the sameCHIPMOS TECHNOLOGIES BERMUDA·Filed 2008·Granted Feb 1, 2011·4 cites·10 claims
- 1470US7579676B2Leadless leadframe implemented in a leadframe-based BGA packageCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Granted Aug 25, 2009·5 cites·7 claims
- 1570US7498251B2Redistribution circuit structureCHIPMOS TECHNOLOGIES BERMUDA·Filed 2007·Granted Mar 3, 2009·10 cites·8 claims
- 1669US6689638B2Substrate-on-chip packaging processCHIPMOS TECHNOLOGIES BERMUDA·Filed 2002·Granted Feb 10, 2004·19 cites·7 claims
- 1768US7368809B2Pillar grid array packageCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Granted May 6, 2008·4 cites·7 claims
- 1866US7316065B2Method for fabricating a plurality of elastic probes in a rowCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Granted Jan 8, 2008·4 cites·5 claims
- 1964US6812720B1Modularized probe card with coaxial transmittersCHIPMOS TECHNOLOGIES BERMUDA·Filed 2003·Granted Nov 2, 2004·11 cites·11 claims
- 2063USRE42349EWafer treating method for making adhesive diesCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Granted May 10, 2011·2 cites·16 claims
- 2153US2009047754A1Packaging method involving rearrangement of diceCHIPMOS TECHNOLOGIES BERMUDA·Filed 2008·Application pending·0 cites
- 2251US7622806B2Laser mark on an IC componentCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Granted Nov 24, 2009·3 cites·11 claims
- 2350US7648902B2Manufacturing method of redistribution circuit structureCHIPMOS TECHNOLOGIES BERMUDA·Filed 2009·Granted Jan 19, 2010·3 cites·8 claims
- 2447US7683462B2Chip package structureCHIPMOS TECHNOLOGIES BERMUDA·Filed 2007·Granted Mar 23, 2010·0 cites·2 claims
- 2545US2008191324A1Chip package structure and method of fabricating the sameCHIPMOS TECHNOLOGIES BERMUDA·Filed 2007·Application pending·0 cites
- 2645US2008224277A1Chip package and method of fabricating the sameCHIPMOS TECHNOLOGIES BERMUDA·Filed 2007·Application pending·0 cites
- 2744US2009146278A1Chip-stacked package structure with asymmetrical leadframeCHIPMOS TECHNOLOGIES BERMUDA·Filed 2007·Application pending·0 cites
- 2843US7696443B2Electronic device with a warped spring connectorCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Granted Apr 13, 2010·0 cites·17 claims
- 2943US2008061411A1Chip-stacked package structure for lead frame having bus bars with transfer padsCHIPMOS TECHNOLOGIES BERMUDA·Filed 2007·Application pending·0 cites
- 3042US2008029903A1Chip-stacked package structureCHIPMOS TECHNOLOGIES BERMUDA·Filed 2007·Application pending·0 cites
- 3140US7370416B2Method of manufacturing an injector plateCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Granted May 13, 2008·0 cites·9 claims
- 3240US2008157304A1Chip package structureCHIPMOS TECHNOLOGIES BERMUDA·Filed 2007·Application pending·0 cites
- 3340US2008224284A1Chip package structureCHIPMOS TECHNOLOGIES BERMUDA·Filed 2007·Application pending·0 cites
- 3439US2006145357A1Flip chip package structureCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Application pending·0 cites
- 3539US2007035008A1Thin IC package for improving heat dissipation from chip backsideCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Application pending·0 cites
- 3635US2006145314A1Tape for tape carrier packageCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Application pending·0 cites
- 3734US2006208365A1Flip-chip-on-film package structureCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Application pending·0 cites
- 3832US2004012405A1Probe card with full wafer contact configurationCHIPMOS TECHNOLOGIES BERMUDA·Filed 2002·Application pending·0 cites
- 3932US2007040262A1Flexible substrate capable of preventing lead thereon from fracturingCHIPMOS TECHNOLOGIES BERMUDA·Filed 2005·Application pending·0 cites
- 4028US2007228555A1Semiconductor chip having fine pitch bumps and bumps thereonCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →