Assignee
CHIPLETZ INC
US·3 granted patents·11 pending applications·0 citations·filing 2022–2025
Top patents by PatentIndex Score
14 records- 0176US12568832B2Through package vertical interconnect and method of making sameCHIPLETZ INC·Filed 2025·Granted Mar 3, 2026·0 cites·5 claims
- 0275US12334455B2Semiconductor package with integrated capacitorsCHIPLETZ INC·Filed 2024·Granted Jun 17, 2025·0 cites·13 claims
- 0375US2025293133A1Through Package Vertical Interconnect and Method of Making SameCHIPLETZ INC·Filed 2025·Application pending·0 cites
- 0473US2025273604A1Semiconductor Package with Integrated CapacitorsCHIPLETZ INC·Filed 2025·Application pending·0 cites
- 0567US2023343687A1Through Package Vertical Interconnect and Method of Making SameCHIPLETZ INC·Filed 2023·Application pending·0 cites
- 0666US12288756B2Semiconductor package with integrated capacitorsCHIPLETZ INC·Filed 2022·Granted Apr 29, 2025·0 cites·10 claims
- 0758US2025210548A1Embedded voltage regulation moduleCHIPLETZ INC·Filed 2024·Application pending·0 cites
- 0857US2026026360A1Apparatus and method for improving yield of advanced packagesCHIPLETZ INC·Filed 2024·Application pending·0 cites
- 0956US2025309153A1Apparatus and Method for Mitigating Crosstalk in an Advanced PackageCHIPLETZ INC·Filed 2024·Application pending·0 cites
- 1053US2024120293A1Method and Apparatus for Prevention, Cessation, Detection, and Monitoring of Cracks in SubstratesCHIPLETZ INC·Filed 2023·Application pending·0 cites
- 1152US2024258041A1Low-Equivalent-Series-Resistance Capacitors with Solid-State Current Collectors Using Conductive InksCHIPLETZ INC·Filed 2024·Application pending·0 cites
- 1251US2024337799A1Co-Packaging Assembly and Method for Attaching Photonic Dies/Modules to Multi-Chip Active/Passive SubstrateCHIPLETZ INC·Filed 2023·Application pending·0 cites
- 1351US2023395305A1Inductors Embedded in Package Substrate and Board and Method and System for Manufacturing the SameCHIPLETZ INC·Filed 2023·Application pending·0 cites
- 1447US2023411174A1Package Assembly and Method of Attaching Multi-Height Dies/Modules to Multi-Chip Active/Passive SubstrateCHIPLETZ INC·Filed 2022·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →