Assignee
CHIMEI CORP
TW·2 granted patents·2 pending applications·1 citations·filing 2018–2024
Top patents by PatentIndex Score
4 records- 0169US2024240010A1Thermoplastic composition and method for producing the same, and molding productCHIMEI CORP·Filed 2024·Application pending·0 cites
- 0264US11106086B2Optical plate with protrusions, optical structure, backlight module and display deviceCHIMEI CORP·Filed 2019·Granted Aug 31, 2021·1 cites·19 claims
- 0362US2025043129A1Thermoplastic resin composition, method for preparing thermoplastic resin composition and use of plastic filmCHIMEI CORP·Filed 2024·Application pending·0 cites
- 0454US11235563B2Resin composition, molded article, food contact appliance and food contact containerCHIMEI CORP·Filed 2018·Granted Feb 1, 2022·0 cites·18 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →