Assignee
CHENGDU PBM TECH LTD
CN·4 granted patents·6 pending applications·0 citations·filing 2021–2025
Top patents by PatentIndex Score
10 records- 0188US2026082589A1High-density three-dimensional multilayer memory and fabrication methodCHENGDU PBM TECH LTD·Filed 2025·Application pending·0 cites
- 0265US12507422B2High-density three-dimensional multilayer memory and fabrication methodCHENGDU PBM TECH LTD·Filed 2021·Granted Dec 23, 2025·0 cites·2 claims
- 0358US12505866B2Underlying transistor circuit of semiconductor memory and preparation method for the sameCHENGDU PBM TECH LTD·Filed 2023·Granted Dec 23, 2025·0 cites·5 claims
- 0456US2025126800A1Semiconductor memory underlying circuit and preparation method for the sameCHENGDU PBM TECH LTD·Filed 2023·Application pending·0 cites
- 0556US2025149445A1Interconnection structure of high-density three-dimensional (3d)-stacked memory and preparation method for the sameCHENGDU PBM TECH LTD·Filed 2023·Application pending·0 cites
- 0653US2025105146A1High-density three-dimensional memory device with interconnection of low resistance and manufacturing method thereofCHENGDU PBM TECH LTD·Filed 2022·Application pending·0 cites
- 0752US12568633B2High-density three-dimensional multilayer memory and fabrication methodCHENGDU PBM TECH LTD·Filed 2021·Granted Mar 3, 2026·0 cites·4 claims
- 0850US2024349496A1Three-dimensional multilayer memory with interconnection of low-resistance silicides and manufacturing method thereofCHENGDU PBM TECH LTD·Filed 2022·Application pending·0 cites
- 0949US12408334B2Method for manufacturing fully self-aligned high-density 3D multi-layer memoryCHENGDU PBM TECH LTD·Filed 2021·Granted Sep 2, 2025·0 cites·9 claims
- 1046US2023069448A1Method for manufacturing high-density three-dimensional programmable memoryCHENGDU PBM TECH LTD·Filed 2021·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →