Assignee
CHENG TIEN CHIEN
TW·2 granted patents·2 pending applications·0 citations·filing 2019–2022
Top patents by PatentIndex Score
4 records- 0153US2023077857A1Chip package fabrication kit and chip package fabricating method thereofCHENG TIEN CHIEN·Filed 2022·Application pending·0 cites
- 0245US12002735B2Semiconductor packageCHENG TIEN CHIEN·Filed 2021·Granted Jun 4, 2024·0 cites·20 claims
- 0345US2021035944A1Chip package fabrication kit and chip package fabricating method thereofCHENG TIEN CHIEN·Filed 2020·Application pending·0 cites
- 0441US11243231B2Vertical probe cardCHENG TIEN CHIEN·Filed 2019·Granted Feb 8, 2022·0 cites·14 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →