Assignee
CHEN NAN-JANG
TW·11 granted patents·1 pending application·39 citations·filing 2007–2012
Top patents by PatentIndex Score
12 records- 0185US8058720B2Semiconductor packageCHEN NAN-JANG·Filed 2008·Granted Nov 15, 2011·14 cites·17 claims
- 0284US9949360B2Printed circuit board design for high speed applicationCHEN NAN JANG·Filed 2012·Granted Apr 17, 2018·6 cites·19 claims
- 0383US8213206B2Electronic apparatusCHEN NAN-JANG·Filed 2010·Granted Jul 3, 2012·6 cites·20 claims
- 0478US8120927B2Printed circuit boardCHEN NAN-JANG·Filed 2008·Granted Feb 21, 2012·6 cites·20 claims
- 0576US8212343B2Semiconductor chip packageCHEN NAN-JANG·Filed 2010·Granted Jul 3, 2012·3 cites·15 claims
- 0667US9445492B2Printed circuit boardCHEN NAN-JANG·Filed 2012·Granted Sep 13, 2016·1 cites·4 claims
- 0766US8525310B2Leadframe package for high-speed data rate applicationsCHEN NAN-JANG·Filed 2011·Granted Sep 3, 2013·2 cites·11 claims
- 0859US8124461B2Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package productCHEN NAN-JANG·Filed 2007·Granted Feb 28, 2012·1 cites·12 claims
- 0952US9681554B2Printed circuit boardCHEN NAN-JANG·Filed 2008·Granted Jun 13, 2017·0 cites·10 claims
- 1050US8288848B2Semiconductor chip package including a lead frameCHEN NAN-JANG·Filed 2011·Granted Oct 16, 2012·0 cites·20 claims
- 1150US8106490B2Semiconductor chip packageCHEN NAN-JANG·Filed 2010·Granted Jan 31, 2012·0 cites·11 claims
- 1245US2012018862A1Semiconductor packageCHEN NAN-JANG·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →