Assignee
CHEN MENG-TSE
TW·13 granted patents·2 pending applications·56 citations·filing 2011–2012
Top patents by PatentIndex Score
15 records- 0191US9349663B2Package-on-package structure having polymer-based material for warpage controlCHEN MENG-TSE·Filed 2012·Granted May 24, 2016·9 cites·20 claims
- 0284US8603860B2Process for forming packagesCHEN MENG-TSE·Filed 2011·Granted Dec 10, 2013·7 cites·20 claims
- 0383US9312214B2Semiconductor packages having polymer-containing substrates and methods of forming sameCHEN MENG-TSE·Filed 2011·Granted Apr 12, 2016·7 cites·20 claims
- 0482US9768137B2Stud bump structure for semiconductor package assembliesCHEN MENG-TSE·Filed 2012·Granted Sep 19, 2017·5 cites·18 claims
- 0582US9412717B2Apparatus and methods for molded underfills in flip chip packagingCHEN MENG-TSE·Filed 2011·Granted Aug 9, 2016·6 cites·20 claims
- 0681US10192804B2Bump-on-trace packaging structure and method for forming the sameCHEN MENG TSE·Filed 2012·Granted Jan 29, 2019·5 cites·19 claims
- 0779US8609462B2Methods for forming 3DIC packageCHEN MENG-TSE·Filed 2011·Granted Dec 17, 2013·4 cites·20 claims
- 0875US9030022B2Packages and methods for forming the sameCHEN MENG-TSE·Filed 2011·Granted May 12, 2015·3 cites·20 claims
- 0975US8586408B2Contact and method of formationCHEN MENG-TSE·Filed 2011·Granted Nov 19, 2013·3 cites·13 claims
- 1073US8889486B2Methods and apparatus for package on package structuresCHEN MENG-TSE·Filed 2012·Granted Nov 18, 2014·3 cites·20 claims
- 1166US8846448B2Warpage control in a package-on-package structureCHEN MENG-TSE·Filed 2012·Granted Sep 30, 2014·2 cites·13 claims
- 1266US8642445B2Method and apparatus for reducing package warpageCHEN MENG-TSE·Filed 2012·Granted Feb 4, 2014·2 cites·20 claims
- 1349US8927391B2Package-on-package process for applying molding compoundCHEN MENG-TSE·Filed 2011·Granted Jan 6, 2015·0 cites·18 claims
- 1448US2013234317A1Packaging Methods and Packaged Semiconductor DevicesCHEN MENG-TSE·Filed 2012·Application pending·0 cites
- 1541US2014048934A1Method to control underfill fillet widthCHEN MENG-TSE·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →