Assignee
CHEN KEI-WEI
1 granted patent·2 pending applications·20 citations·filing 2004–2011
Top patents by PatentIndex Score
3 records- 0168US7071100B2Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene processCHEN KEI-WEI·Filed 2004·Granted Jul 4, 2006·20 cites·22 claims
- 0241US2009127097A1Forming Seed Layer in Nano-Trench Structure Using Net Deposition and Net EtchCHEN KEI-WEI·Filed 2007·Application pending·0 cites
- 0335US2012264303A1Chemical mechanical polishing slurry, system and methodCHEN KEI-WEI·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when CHEN KEI-WEI files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →