Assignee
CHEN JEN-CHUNG
TW·2 granted patents·3 pending applications·5 citations·filing 2009–2010
Top patents by PatentIndex Score
5 records- 0172US8143712B2Die package structureCHEN JEN-CHUNG·Filed 2010·Granted Mar 27, 2012·5 cites·6 claims
- 0244US8157621B2Wafer back side grinding processCHEN JEN-CHUNG·Filed 2009·Granted Apr 17, 2012·0 cites·18 claims
- 0340US2011084374A1Semiconductor package with sectioned bonding wire schemeCHEN JEN-CHUNG·Filed 2009·Application pending·0 cites
- 0440US2011117232A1Semiconductor chip package with mold locksCHEN JEN-CHUNG·Filed 2009·Application pending·0 cites
- 0530US2011115067A1Semiconductor chip package with mold locksCHEN JEN-CHUNG·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →