Assignee
CHEN HSIEN TE
TW·2 granted patents·4 pending applications·4 citations·filing 2006–2012
Top patents by PatentIndex Score
6 records- 0176US8748513B2Epoxy resin composition, and prepreg and printed circuit board using the sameCHEN HSIEN-TE·Filed 2010·Granted Jun 10, 2014·4 cites·14 claims
- 0253US2008099751A1Fence assembly with projected lightCHEN HSIEN-TE·Filed 2006·Application pending·0 cites
- 0351US2011284276A1Epoxy resin composition, and prepreg and printed circuit board using the sameCHEN HSIEN TE·Filed 2010·Application pending·0 cites
- 0447US8734950B2Resin composition and uses of the sameCHEN HSIEN-TE·Filed 2011·Granted May 27, 2014·0 cites·12 claims
- 0541US2013143046A1Epoxy resin composition, and prepreg and metal-clad laminate using the sameCHEN HSIEN TE·Filed 2012·Application pending·0 cites
- 0639US2011253434A1Epoxy resin composition, and prepreg and printed circuit board using the sameCHEN HSIEN-TE·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →