Assignee
CHEN DA-JUNG
TW·9 granted patents·36 citations·filing 2007–2012
Top patents by PatentIndex Score
9 records- 0190US8338933B2Three-dimensional package structureCHEN DA-JUNG·Filed 2011·Granted Dec 25, 2012·11 cites·9 claims
- 0283US8824165B2Electronic package structureCHEN DA-JUNG·Filed 2011·Granted Sep 2, 2014·7 cites·20 claims
- 0381US9111954B2Power conversion moduleCHEN DA-JUNG·Filed 2011·Granted Aug 18, 2015·8 cites·11 claims
- 0479US8338928B2Three-dimensional package structureCHEN DA-JUNG·Filed 2007·Granted Dec 25, 2012·7 cites·22 claims
- 0566US9271398B2Power supply moduleCHEN DA-JUNG·Filed 2012·Granted Feb 23, 2016·2 cites·14 claims
- 0654US8253041B2Electronic element packaging moduleCHEN DA-JUNG·Filed 2010·Granted Aug 28, 2012·1 cites·25 claims
- 0753US9601412B2Three-dimensional package structureCHEN DA-JUNG·Filed 2012·Granted Mar 21, 2017·0 cites·17 claims
- 0853US9001527B2Electronic package structureCHEN DA-JUNG·Filed 2012·Granted Apr 7, 2015·0 cites·15 claims
- 0936US9171818B2Package structure and the method to manufacture thereofCHEN DA-JUNG·Filed 2011·Granted Oct 27, 2015·0 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when CHEN DA-JUNG files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →