Assignee
CHEN CHUN HSIA
TW·0 granted patents·7 pending applications·0 citations·filing 2021–2023
Top patents by PatentIndex Score
7 records- 0148US2025201505A1Chip-type fuseCHEN CHUN HSIA·Filed 2023·Application pending·0 cites
- 0241US2023326843A1Electric contact structure for three-dimensional chip package moduleCHEN CHUN HSIA·Filed 2022·Application pending·0 cites
- 0340US2023147337A1Three-dimensional ltcc package structureCHEN CHUN HSIA·Filed 2021·Application pending·0 cites
- 0439US2023131658A1Three-dimensional ltcc package structureCHEN CHUN HSIA·Filed 2021·Application pending·0 cites
- 0539US2023126956A1Method for manufacturing a three-dimensional ltcc package structureCHEN CHUN HSIA·Filed 2021·Application pending·0 cites
- 0637US2022367363A1Ltcc electronic device unit structureCHEN CHUN HSIA·Filed 2021·Application pending·0 cites
- 0736US2023070377A1Integrated structure of circuit mold unit of ltcc electronic deviceCHEN CHUN HSIA·Filed 2021·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →