Assignee
CHAO DENNY
0 granted patents·3 pending applications·0 citations·filing 2004–2005
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0117US2005277229A1Chip packaging structure and method of making wafer level packagingCHAO DENNY·Filed 2005·Application pending·0 cites
- 0212US2005212118A1Chip packaging structure and method of making wafer level packagingCHAO DENNY·Filed 2004·Application pending·0 cites
- 0310US2005214975A1Method of fabricating the planar encapsulated surfaceCHAO DENNY·Filed 2004·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →