Assignee
CHANG WEI SEN
TW·3 granted patents·42 citations·filing 2010–2012
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0195US8232193B2Method of forming Cu pillar capped by barrier layerCHANG WEI SEN·Filed 2010·Granted Jul 31, 2012·26 cites·20 claims
- 0289US8653659B2Integrated circuit device including a copper pillar capped by barrier layerCHANG WEI SEN·Filed 2012·Granted Feb 18, 2014·8 cites·20 claims
- 0385US8766441B2Methods and apparatus for solder on slot connections in package on package structuresCHANG WEI SEN·Filed 2012·Granted Jul 1, 2014·8 cites·19 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →