Assignee
CHANG WAH TECH CO LTD
TW·15 granted patents·5 pending applications·20 citations·filing 2014–2022
Top patents by PatentIndex Score
20 records- 0187US9799613B1Lead frame deviceCHANG WAH TECH CO LTD·Filed 2017·Granted Oct 24, 2017·7 cites·8 claims
- 0283US10424535B2Pre-molded leadframe deviceCHANG WAH TECH CO LTD·Filed 2018·Granted Sep 24, 2019·4 cites·16 claims
- 0377US10068837B1Universal preformed lead frame deviceCHANG WAH TECH CO LTD·Filed 2017·Granted Sep 4, 2018·3 cites·9 claims
- 0473US10424694B2Light emitting device packageCHANG WAH TECH CO LTD·Filed 2018·Granted Sep 24, 2019·2 cites·12 claims
- 0571US10475730B2Preformed lead frame device and lead frame package including the sameCHANG WAH TECH CO LTD·Filed 2017·Granted Nov 12, 2019·2 cites·9 claims
- 0671US10217699B2Preformed lead frameCHANG WAH TECH CO LTD·Filed 2017·Granted Feb 26, 2019·2 cites·2 claims
- 0753US12113001B2Lead frame assembly having a plurality of dicing holesCHANG WAH TECH CO LTD·Filed 2022·Granted Oct 8, 2024·0 cites·11 claims
- 0852US12206060B2Lead frame assembly and chip packaging deviceCHANG WAH TECH CO LTD·Filed 2022·Granted Jan 21, 2025·0 cites·10 claims
- 0951US11495523B2Lead frame having a die pad with a plurality of grooves on an undersideCHANG WAH TECH CO LTD·Filed 2021·Granted Nov 8, 2022·0 cites·10 claims
- 1049US2022231208A1Composite lead frame and light-emitting diode package structure including the sameCHANG WAH TECH CO LTD·Filed 2021·Application pending·0 cites
- 1145US9847279B2Composite lead frame structureCHANG WAH TECH CO LTD·Filed 2014·Granted Dec 19, 2017·0 cites·9 claims
- 1244US10607926B1Preformed lead frame deviceCHANG WAH TECH CO LTD·Filed 2019·Granted Mar 31, 2020·0 cites·9 claims
- 1343US10600726B2Leadframe and method of making the sameCHANG WAH TECH CO LTD·Filed 2018·Granted Mar 24, 2020·0 cites·16 claims
- 1443US2021098358A1Semiconductor packageCHANG WAH TECH CO LTD·Filed 2019·Application pending·0 cites
- 1542US10937728B2Preformed lead frame and lead frame package made from the sameCHANG WAH TECH CO LTD·Filed 2019·Granted Mar 2, 2021·0 cites·16 claims
- 1640US9984980B2Molded lead frame deviceCHANG WAH TECH CO LTD·Filed 2017·Granted May 29, 2018·0 cites·6 claims
- 1739US2020227343A1Semiconductor device packageCHANG WAH TECH CO LTD·Filed 2019·Application pending·0 cites
- 1838US2019341338A1Preformed lead frame and lead frame package made from the sameCHANG WAH TECH CO LTD·Filed 2018·Application pending·0 cites
- 1937US10373886B2Preformed lead frame and lead frame packaged structure including the sameCHANG WAH TECH CO LTD·Filed 2017·Granted Aug 6, 2019·0 cites·7 claims
- 2034US2017194235A1Lead frame and semiconductor package structureCHANG WAH TECH CO LTD·Filed 2016·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →