Assignee
CH POLYMERS OY
FI·0 granted patents·3 pending applications·0 citations·filing 2019–2021
Top patents by PatentIndex Score
3 records- 0139US2022411556A1A polymer dispersion comprising hemicelluloseCH POLYMERS OY·Filed 2020·Application pending·0 cites
- 0232US2024102247A1A method for producing a heat sealable multi-layer paperboard and a heat sealable multi-layer paperboard obtainable by the methodCH POLYMERS OY·Filed 2021·Application pending·0 cites
- 0327US2022056644A1A method for sealing paperboardCH POLYMERS OY·Filed 2019·Application pending·0 cites
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