Assignee
CELERITY RES PTE LTD
SG·5 granted patents·111 citations·filing 2001–2005
Top patents by PatentIndex Score
5 records- 0195US7144759B1Technology partitioning for advanced flip-chip packagingCELERITY RES PTE LTD·Filed 2005·Granted Dec 5, 2006·71 cites·17 claims
- 0276US6762509B2Flip-chip packaging method that treats an interconnect substrate to control stress created at edges of fill materialCELERITY RES PTE LTD·Filed 2001·Granted Jul 13, 2004·24 cites·6 claims
- 0361US6737752B2Flip-chip package containing a chip and a substrate having differing pitches for electrical connectionsCELERITY RES PTE LTD·Filed 2002·Granted May 18, 2004·9 cites·7 claims
- 0449US6576073B2Adhesive control during stiffener attachment to provide co-planarity in flip chip packagesCELERITY RES PTE LTD·Filed 2001·Granted Jun 10, 2003·5 cites·5 claims
- 0545US6699732B2Pitch compensation in flip-chip packagingCELERITY RES PTE LTD·Filed 2002·Granted Mar 2, 2004·2 cites·9 claims
Join the waitlist — get patent alerts
Get an alert when CELERITY RES PTE LTD files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →