Assignee
CARSEM M SDN BHD
MY·18 granted patents·3 pending applications·94 citations·filing 2003–2019
Top patents by PatentIndex Score
21 records- 0186US8674488B2Light emitting diode (LED) packagesCARSEM M SDN BHD·Filed 2013·Granted Mar 18, 2014·9 cites·19 claims
- 0286US7273767B2Method of manufacturing a cavity packageCARSEM M SDN BHD·Filed 2005·Granted Sep 25, 2007·31 cites·24 claims
- 0379US7846774B2Multiple row exposed leads for MLP high density packagesCARSEM M SDN BHD·Filed 2006·Granted Dec 7, 2010·15 cites·19 claims
- 0468US7214562B2Method for encapsulating lead frame packagesCARSEM M SDN BHD·Filed 2005·Granted May 8, 2007·11 cites·21 claims
- 0566US9935039B2Pre-molded integrated circuit packagesCARSEM M SDN BHD·Filed 2014·Granted Apr 3, 2018·2 cites·10 claims
- 0665US11114367B2Molded integrated circuit packages and methods of forming the sameCARSEM M SDN BHD·Filed 2019·Granted Sep 7, 2021·1 cites·21 claims
- 0762US8946913B2Short and low loop wire bondingCARSEM M SDN BHD·Filed 2013·Granted Feb 3, 2015·2 cites·19 claims
- 0855US9640517B2Stacked electronic packagesCARSEM (M) SDN BHD·Filed 2014·Granted May 2, 2017·2 cites·20 claims
- 0953US9048397B2Color yield of white LEDsCARSEM M SDN BHD·Filed 2014·Granted Jun 2, 2015·1 cites·20 claims
- 1051US7741161B2Method of making integrated circuit package with transparent encapsulantCARSEM M SDN BHD·Filed 2008·Granted Jun 22, 2010·2 cites·11 claims
- 1150US10147700B2Flexible window clampCARSEM M SDN BHD·Filed 2017·Granted Dec 4, 2018·1 cites·20 claims
- 1248US7351611B2Method of making the mould for encapsulating a leadframe packageCARSEM M SDN BHD·Filed 2004·Granted Apr 1, 2008·8 cites·4 claims
- 1348US7288833B2Stress-free lead frameCARSEM M SDN BHD·Filed 2004·Granted Oct 30, 2007·5 cites·16 claims
- 1446US8941249B2Low loop wire bondingCARSEM M SDN BHD·Filed 2013·Granted Jan 27, 2015·0 cites·20 claims
- 1546US2018211902A1Pre-molded integrated circuit packagesCARSEM M SDN BHD·Filed 2018·Application pending·0 cites
- 1645US7786554B2Stress-free lead frameCARSEM M SDN BHD·Filed 2007·Granted Aug 31, 2010·0 cites·11 claims
- 1744US9691688B2Thin plastic leadless package with exposed metal die paddleCARSEM (M) SDN BHD·Filed 2015·Granted Jun 27, 2017·0 cites·5 claims
- 1842US6953711B2Flip chip on lead frameCARSEM M SDN BHD·Filed 2003·Granted Oct 11, 2005·4 cites·22 claims
- 1939US2014021491A1Multi-compound moldingCARSEM M SDN BHD·Filed 2013·Application pending·0 cites
- 2038US10468319B2Low-profile electronic packageCARSEM M SDN BHD·Filed 2017·Granted Nov 5, 2019·0 cites·20 claims
- 2135US2005167790A1Integrated circuit package with transparent encapsulant and method for making thereofCARSEM M SDN BHD·Filed 2004·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →