Individual holder
BUNYAN MICHAEL H
US·4 granted patents·2 pending applications·73 citations·filing 2006–2012
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
6 records- 0197US8766108B2Encapsulated expanded crimped metal mesh for sealing and EMI shielding applicationsBUNYAN MICHAEL H·Filed 2011·Granted Jul 1, 2014·30 cites·25 claims
- 0293US8759692B2Encapsulated expanded crimped metal mesh for sealing, EMI shielding and lightning strike applicationsBUNYAN MICHAEL H·Filed 2012·Granted Jun 24, 2014·21 cites·10 claims
- 0387US8633402B2Low force deflection and corrosion resistant EMI gasketBUNYAN MICHAEL H·Filed 2011·Granted Jan 21, 2014·8 cites·10 claims
- 0479US8119191B2Dispensable cured resinBUNYAN MICHAEL H·Filed 2007·Granted Feb 21, 2012·14 cites·15 claims
- 0545US2006263570A1Thermal lamination moduleBUNYAN MICHAEL H·Filed 2006·Application pending·0 cites
- 0631US2012133072A1Fully-cured thermally or electrically conductive form-in-place gap fillerBUNYAN MICHAEL H·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →