Assignee

BONE GREGORY ALAN

US·1 granted patent·1 pending application·6 citations·filing 2007–2008

Technology mixH10W2 Y10T2 H05K1 H10F1 Y02E1 Y02P1

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2 records

0164US8124519B2Apparatus and method for bonding silicon wafer to conductive substrateBONE GREGORY ALAN·Filed 2008·Granted Feb 28, 2012·6 cites·4 claims
0237US2007226995A1System and method for adhering large semiconductor applications to pcbBONE GREGORY ALAN·Filed 2007·Application pending·0 cites

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