Assignee

BINDRUP RANDY WAYNE

1 granted patent·5 citations·filing 2007–2007

Technology mixB23K1 H10W1

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1 record

0163US7772045B1Wire bond method for angularly disposed conductive pads and a device made from the methodBINDRUP RANDY WAYNE·Filed 2007·Granted Aug 10, 2010·5 cites·40 claims

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