Assignee
BAE RAYMOND WON
US·0 granted patents·5 pending applications·0 citations·filing 2021–2021
Top patents by PatentIndex Score
5 records- 0123US2022187341A1Microelectronic test interface substrates, devices, and methods of manufacture thereof layer level test and repair on buildup redistribution layersBAE RAYMOND WON·Filed 2021·Application pending·0 cites
- 0222US2023140738A1Microelectronic test and package interface substrates, devices, and methods of manufacture thereof alignment improvement of interconnect on buildup redistribution layersBAE RAYMOND WON·Filed 2021·Application pending·0 cites
- 0322US2022214381A1Microelectronic test interface substrates, devices, and methods of mounting on a printed circuit test load boardBAE RAYMOND WON·Filed 2021·Application pending·0 cites
- 0421US2022187342A1Microelectronic test interface substrates, devices, and methods of manufacture thereof vertical and horizontal electrical shield on inner layer connecting conductor vias and conductor traces of any positions on buildup redistribution layer systemBAE RAYMOND WON·Filed 2021·Application pending·0 cites
- 0521US2023140814A1Microelectronic test interface substrates, devices, and methods of manufacture thereof probe head test contact pin shield and dielectric insulation on top layer of buildup redistribution layer systemBAE RAYMOND WON·Filed 2021·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →