Assignee
ASAHI SEIKI CO LTD
JP·2 granted patents·1 pending application·11 citations·filing 2006–2014
Top patents by PatentIndex Score
3 records- 0166US7861889B2Thin-part feeding deviceASAHI SEIKI CO LTD·Filed 2006·Granted Jan 4, 2011·9 cites·3 claims
- 0252US9620919B2Process for producing shield layer-cut electric wireASAHI SEIKI CO LTD·Filed 2014·Granted Apr 11, 2017·2 cites·2 claims
- 0346US2016126707A1Cover-layer cutting apparatusASAHI SEIKI CO LTD·Filed 2014·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →