Assignee
AP MEMORY TECH CORPORATION
TW·13 granted patents·19 pending applications·51 citations·filing 2017–2025
Top patents by PatentIndex Score
32 records- 0198US11417628B2Method for manufacturing semiconductor structureAP MEMORY TECH CORPORATION·Filed 2020·Granted Aug 16, 2022·11 cites·25 claims
- 0294US10020311B1Semiconductor memory device provided with DRAM cell including two transistors and common capacitorAP MEMORY TECH CORPORATION·Filed 2017·Granted Jul 10, 2018·37 cites·13 claims
- 0392US12176320B2Semiconductor structure and methods for bonding tested wafers and testing pre-bonded wafersAP MEMORY TECH CORPORATION·Filed 2022·Granted Dec 24, 2024·2 cites·20 claims
- 0485US2026073974A1Memory device having segmented data line structureAP MEMORY TECH CORPORATION·Filed 2025·Application pending·0 cites
- 0582US11672111B2Semiconductor structure and method for manufacturing a plurality thereofAP MEMORY TECH CORPORATION·Filed 2020·Granted Jun 6, 2023·1 cites·20 claims
- 0677US12394473B2Interface of a memory circuitAP MEMORY TECH CORPORATION·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 0774US12048142B2Methods for manufacturing a plurality of semiconductor structures and system in packageAP MEMORY TECH CORPORATION·Filed 2023·Granted Jul 23, 2024·0 cites·19 claims
- 0867US11842763B2Interface of a memory circuit and memory system thereofAP MEMORY TECH CORPORATION·Filed 2021·Granted Dec 12, 2023·0 cites·26 claims
- 0966US12499931B2Memory device having segmented data line structureAP MEMORY TECH CORPORATION·Filed 2023·Granted Dec 16, 2025·0 cites·20 claims
- 1066US11967363B2Display controller having a surge protection unit and display system thereofAP MEMORY TECH CORPORATION·Filed 2021·Granted Apr 23, 2024·0 cites·16 claims
- 1163US2026101725A1Semiconductor device, testing system, and method for testing device under test on semiconductor waferAP MEMORY TECH CORPORATION·Filed 2024·Application pending·0 cites
- 1263US2025004045A1Semiconductor package and method for identifying integrated circuit layers in stackAP MEMORY TECH CORPORATION·Filed 2024·Application pending·0 cites
- 1363US2026068622A1Semiconductor device with backside power deliveryAP MEMORY TECH CORPORATION·Filed 2024·Application pending·0 cites
- 1462US12334139B2Memory device having merged banks on substrate, and method for operating memory deviceAP MEMORY TECH CORPORATION·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 1561US11688681B2DRAM chiplet structure and method for manufacturing the sameAP MEMORY TECH CORPORATION·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
- 1660US12272643B2Semiconductor device with identification structure, method for manufacturing and tracing production information thereofAP MEMORY TECH CORPORATION·Filed 2022·Granted Apr 8, 2025·0 cites·18 claims
- 1760US2025311392A1Capacitor structureAP MEMORY TECH CORPORATION·Filed 2024·Application pending·0 cites
- 1857US2026101739A1Device packageAP MEMORY TECH CORPORATION·Filed 2025·Application pending·0 cites
- 1957US2025157953A1Vertical semiconductor rfid structure, rfid tag device, and manufacturing method thereofAP MEMORY TECH CORPORATION·Filed 2024·Application pending·0 cites
- 2057US2024421141A1High performance computing device and method of manufacturing the sameAP MEMORY TECH CORPORATION·Filed 2024·Application pending·0 cites
- 2155US2026024610A1Memory deviceAP MEMORY TECH CORPORATION·Filed 2024·Application pending·0 cites
- 2254US2025329689A1Semiconductor package structureAP MEMORY TECH CORPORATION·Filed 2024·Application pending·0 cites
- 2353US2024379623A1Semiconductor package structure and method for forming the sameAP MEMORY TECH CORPORATION·Filed 2024·Application pending·0 cites
- 2453US2022238430A1Capacitor structure, semiconductor structure, and method for manufacturing thereofAP MEMORY TECH CORPORATION·Filed 2022·Application pending·0 cites
- 2552US2025046720A1Semiconductor structure having conductive bridge structureAP MEMORY TECH CORPORATION·Filed 2023·Application pending·0 cites
- 2651US2025126811A1Semiconductor device and method of manufacturing thereofAP MEMORY TECH CORPORATION·Filed 2024·Application pending·0 cites
- 2751US2025279397A1Semiconductor structure and method for manufacturing a semiconductor structureAP MEMORY TECH CORPORATION·Filed 2024·Application pending·0 cites
- 2851US2022045162A1Interposer structure and method for manufacturing thereofAP MEMORY TECH CORPORATION·Filed 2021·Application pending·0 cites
- 2947US12243606B2Semiconductor device, memory system and method of controlling semiconductor device thereofAP MEMORY TECH CORPORATION·Filed 2021·Granted Mar 4, 2025·0 cites·17 claims
- 3046US2025309203A1Semiconductor structure and manufacturing method thereofAP MEMORY TECH CORPORATION·Filed 2024·Application pending·0 cites
- 3146US2025125276A1Package substrate, semiconductor device, and method for forming package substrateAP MEMORY TECH CORPORATION·Filed 2024·Application pending·0 cites
- 3243US2024055343A1Semiconductor package structureAP MEMORY TECH CORPORATION·Filed 2023·Application pending·0 cites
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