Assignee
AOKI SYUZO
JP·2 granted patents·14 citations·filing 2009–2011
Top patents by PatentIndex Score
2 records- 0179US9101981B2Method of manufacturing metal composite material, metal composite material, method of manufacturing heat dissipating component, and heat dissipating componentAOKI SYUZO·Filed 2011·Granted Aug 11, 2015·4 cites·8 claims
- 0275US8213182B2Housing case for housing electronic circuit board, and electronic apparatusAOKI SYUZO·Filed 2009·Granted Jul 3, 2012·10 cites·10 claims
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