Assignee
ANAM SEMICONDUCTOR INC
KR·57 granted patents·6 pending applications·2,741 citations·filing 1996–2005
Top patents by PatentIndex Score
63 records- 0199US6303997B1Thin, stackable semiconductor packagesANAM SEMICONDUCTOR INC·Filed 1999·Granted Oct 16, 2001·528 cites·35 claims
- 0296US5866939ALead end grid array semiconductor packageANAM SEMICONDUCTOR INC·Filed 1996·Granted Feb 2, 1999·358 cites·56 claims
- 0392US5953589ABall grid array semiconductor package with solder balls fused on printed circuit board and method for fabricating the sameANAM SEMICONDUCTOR INC·Filed 1997·Granted Sep 14, 1999·139 cites·20 claims
- 0491US6268568B1Printed circuit board with oval solder ball lands for BGA semiconductor packagesANAM SEMICONDUCTOR INC·Filed 1999·Granted Jul 31, 2001·124 cites·18 claims
- 0591US5905633ABall grid array semiconductor package using a metal carrier ring as a heat spreaderANAM SEMICONDUCTOR INC·Filed 1996·Granted May 18, 1999·128 cites·6 claims
- 0689US6150709AGrid array type lead frame having lead ends in different planesANAM SEMICONDUCTOR INC·Filed 1998·Granted Nov 21, 2000·100 cites·34 claims
- 0788US5872399ASolder ball land metal structure of ball grid semiconductor packageANAM SEMICONDUCTOR INC·Filed 1997·Granted Feb 16, 1999·274 cites·8 claims
- 0885US5908317AMethod of forming chip bumps of bump chip scale semiconductor packageANAM SEMICONDUCTOR INC·Filed 1997·Granted Jun 1, 1999·117 cites·20 claims
- 0984US5864470AFlexible circuit board for ball grid array semiconductor packageANAM SEMICONDUCTOR INC·Filed 1997·Granted Jan 26, 1999·75 cites·17 claims
- 1084US5858815ASemiconductor package and method for fabricating the sameANAM SEMICONDUCTOR INC·Filed 1996·Granted Jan 12, 1999·80 cites·13 claims
- 1183US6339004B1Method of forming shallow trench isolation for preventing torn oxideANAM SEMICONDUCTOR INC·Filed 2000·Granted Jan 15, 2002·35 cites·9 claims
- 1283US5854511ASemiconductor package including heat sink with layered conductive plate and non-conductive tape bonding to leadsANAM SEMICONDUCTOR INC·Filed 1996·Granted Dec 29, 1998·93 cites·15 claims
- 1381US6020218AMethod of manufacturing ball grid array semiconductor packageANAM SEMICONDUCTOR INC·Filed 1998·Granted Feb 1, 2000·68 cites·19 claims
- 1481US5986334ASemiconductor package having light, thin, simple and compact structureANAM SEMICONDUCTOR INC·Filed 1997·Granted Nov 16, 1999·65 cites·30 claims
- 1580US6214645B1Method of molding ball grid array semiconductor packagesANAM SEMICONDUCTOR INC·Filed 1999·Granted Apr 10, 2001·60 cites·14 claims
- 1680US6091141ABump chip scale semiconductor packageANAM SEMICONDUCTOR INC·Filed 1998·Granted Jul 18, 2000·51 cites·20 claims
- 1779US6821877B1Method of fabricating metal interconnection of semiconductor deviceANAM SEMICONDUCTOR INC·Filed 2003·Granted Nov 23, 2004·27 cites·7 claims
- 1878US6246015B1Printed circuit board for ball grid array semiconductor packagesANAM SEMICONDUCTOR INC·Filed 1999·Granted Jun 12, 2001·56 cites·19 claims
- 1972US5981873APrinted circuit board for ball grid array semiconductor packageANAM SEMICONDUCTOR INC·Filed 1997·Granted Nov 9, 1999·42 cites·4 claims
- 2069US6794702B2Semiconductor device and fabrication method thereofANAM SEMICONDUCTOR INC·Filed 2003·Granted Sep 21, 2004·13 cites·5 claims
- 2169US6255176B1Method of forming trench for semiconductor device isolationANAM SEMICONDUCTOR INC·Filed 2000·Granted Jul 3, 2001·29 cites·13 claims
- 2267US6727157B2Method for forming a shallow trench isolation using air gapANAM SEMICONDUCTOR INC·Filed 2003·Granted Apr 27, 2004·14 cites·8 claims
- 2366US5977624ASemiconductor package and assembly for fabricating the sameANAM SEMICONDUCTOR INC·Filed 1998·Granted Nov 2, 1999·33 cites·21 claims
- 2460US5897334AMethod for reproducing printed circuit boards for semiconductor packages including poor quality printed circuit board units and method for fabricating semiconductor packages using the reproduced printed circuit boardsANAM SEMICONDUCTOR INC·Filed 1997·Granted Apr 27, 1999·26 cites·10 claims
- 2559US6887766B2Semiconductor device and method of fabricating the sameANAM SEMICONDUCTOR INC·Filed 2003·Granted May 3, 2005·9 cites·8 claims
- 2658US6453496B1Apparatus for removing contaminant particles on a photomaskANAM SEMICONDUCTOR INC·Filed 2000·Granted Sep 24, 2002·6 cites·10 claims
- 2755US6903026B2Sputter etch methodsANAM SEMICONDUCTOR INC·Filed 2004·Granted Jun 7, 2005·4 cites·10 claims
- 2855US6489651B1MOS transistor that inhibits punchthroughANAM SEMICONDUCTOR INC·Filed 2000·Granted Dec 3, 2002·5 cites·16 claims
- 2955US6448183B1Method of forming contact portion of semiconductor elementANAM SEMICONDUCTOR INC·Filed 2000·Granted Sep 10, 2002·5 cites·12 claims
- 3055US6200841B1MOS transistor that inhibits punchthrough and method for fabricating the sameANAM SEMICONDUCTOR INC·Filed 1998·Granted Mar 13, 2001·13 cites·16 claims
- 3155US6021563AMarking Bad printed circuit boards for semiconductor packagesANAM SEMICONDUCTOR INC·Filed 1997·Granted Feb 8, 2000·20 cites·4 claims
- 3254US6884680B2Method for manufacturing non-volatile memory devicesANAM SEMICONDUCTOR INC·Filed 2004·Granted Apr 26, 2005·5 cites·6 claims
- 3352US5971734AMold for ball grid array semiconductor packageANAM SEMICONDUCTOR INC·Filed 1997·Granted Oct 26, 1999·32 cites·29 claims
- 3451US6844232B2Flash memory device and fabricating method thereforANAM SEMICONDUCTOR INC·Filed 2003·Granted Jan 18, 2005·4 cites·10 claims
- 3551US6518141B2Method for manufacturing a radio frequency integrated circuit on epitaxial siliconANAM SEMICONDUCTOR INC·Filed 2001·Granted Feb 11, 2003·6 cites·17 claims
- 3651US6391500B1Photomask for obtaining a graded pattern profile on a photoresistANAM SEMICONDUCTOR INC·Filed 2000·Granted May 21, 2002·3 cites·9 claims
- 3750US6849538B2Semiconductor device and a fabrication method thereofANAM SEMICONDUCTOR INC·Filed 2003·Granted Feb 1, 2005·2 cites·16 claims
- 3850US6709925B1Split-gate flash memory cell and manufacturing method thereofANAM SEMICONDUCTOR INC·Filed 2002·Granted Mar 23, 2004·5 cites·4 claims
- 3949US6830997B2Semiconductor devices and methods for forming semiconductor devicesANAM SEMICONDUCTOR INC·Filed 2003·Granted Dec 14, 2004·2 cites·4 claims
- 4049US6426277B1Methods and a device for heat treating a semiconductor wafer having different kinds of impuritiesANAM SEMICONDUCTOR INC·Filed 1999·Granted Jul 30, 2002·19 cites·19 claims
- 4149US5858149AProcess for bonding semiconductor chipANAM SEMICONDUCTOR INC·Filed 1996·Granted Jan 12, 1999·14 cites·4 claims
- 4247US6207562B1Method of forming titanium silicideANAM SEMICONDUCTOR INC·Filed 1998·Granted Mar 27, 2001·10 cites·16 claims
- 4345US6841471B2Fabrication method of semiconductor deviceANAM SEMICONDUCTOR INC·Filed 2003·Granted Jan 11, 2005·2 cites·15 claims
- 4445US2005136619A1Semiconductor devices and methods of forming a trench in a semiconductor deviceANAM SEMICONDUCTOR INC·Filed 2005·Application pending·0 cites
- 4544US6759287B2Semiconductor device and fabrication method thereofANAM SEMICONDUCTOR INC·Filed 2003·Granted Jul 6, 2004·2 cites·6 claims
- 4643US6876065B2Semiconductor device and a fabrication method thereofANAM SEMICONDUCTOR INC·Filed 2004·Granted Apr 5, 2005·0 cites·12 claims
- 4741US6340623B1Method of fabricating semiconductor deviceANAM SEMICONDUCTOR INC·Filed 2000·Granted Jan 22, 2002·1 cites·7 claims
- 4840US2005145979A1Semiconductor devices and methods to form trenches in semiconductor devicesANAM SEMICONDUCTOR INC·Filed 2004·Application pending·0 cites
- 4939US6013554AMethod for fabricating an LDD MOS transistorANAM SEMICONDUCTOR INC·Filed 1998·Granted Jan 11, 2000·7 cites·21 claims
- 5039US2004152247A1MOS transistor and fabrication method thereofANAM SEMICONDUCTOR INC·Filed 2003·Application pending·0 cites
Showing the top 50 of 63 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when ANAM SEMICONDUCTOR INC files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →