Assignee
AGARWAL RAHUL
IN·6 granted patents·5 pending applications·87 citations·filing 2011–2018
Top patents by PatentIndex Score
11 records- 0198US10727204B2Die stacking for multi-tier 3D integrationAGARWAL RAHUL·Filed 2018·Granted Jul 28, 2020·34 cites·21 claims
- 0295US10312221B1Stacked dies and dummy components for improved thermal performanceAGARWAL RAHUL·Filed 2017·Granted Jun 4, 2019·31 cites·22 claims
- 0391US10529693B23D stacked dies with disparate interconnect footprintsAGARWAL RAHUL·Filed 2017·Granted Jan 7, 2020·8 cites·20 claims
- 0490US10593620B2Fan-out package with multi-layer redistribution layer structureAGARWAL RAHUL·Filed 2018·Granted Mar 17, 2020·7 cites·14 claims
- 0584US10175084B2Flat measuring apparatus with plurality of hingesAGARWAL RAHUL·Filed 2016·Granted Jan 8, 2019·3 cites·6 claims
- 0678US8669166B1Methods of thinning and/or dicing semiconducting substrates having integrated circuit products formed thereonAGARWAL RAHUL·Filed 2012·Granted Mar 11, 2014·4 cites·17 claims
- 0752US2013085917A1Event risk assessmentAGARWAL RAHUL·Filed 2011·Application pending·0 cites
- 0852US2013103554A1Banking systemAGARWAL RAHUL·Filed 2011·Application pending·0 cites
- 0944US2014129914A1Method of pre-populating editable electronic forms using trusted relationship based id codesAGARWAL RAHUL·Filed 2012·Application pending·0 cites
- 1041US2014070405A1Stacked semiconductor devices with a glass window wafer having an engineered coefficient of thermal expansion and methods of making sameAGARWAL RAHUL·Filed 2012·Application pending·0 cites
- 1139US2019326257A1High density fan-out packagingAGARWAL RAHUL·Filed 2018·Application pending·0 cites
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