Assignee
ADVANCED TECHNICAL CERAM COMPANY
US·1 granted patent·1 pending application·0 citations·filing 2022–2024
Top patents by PatentIndex Score
2 records- 0150US12261123B2Selective metallization of integrated circuit packagesADVANCED TECHNICAL CERAM COMPANY·Filed 2022·Granted Mar 25, 2025·0 cites·30 claims
- 0242US2024304539A1Metal-ceramic mixed package substrate plated with non-magnetic layer stackADVANCED TECHNICAL CERAM COMPANY·Filed 2024·Application pending·0 cites
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