Assignee
ADVANCED SYSTEMS AUTOMATION LI
SG·3 granted patents·70 citations·filing 1997–1997
Top patents by PatentIndex Score
3 records- 0160US5989471ABGA mould assembly for encapsulating BGA substrates of varying thicknessADVANCED SYSTEMS AUTOMATION LI·Filed 1997·Granted Nov 23, 1999·30 cites·9 claims
- 0255US6030569APackaging process using a wedge device for linear force amplification in a pressADVANCED SYSTEMS AUTOMATION LI·Filed 1997·Granted Feb 29, 2000·21 cites·18 claims
- 0341US6013541AMethod and apparatus for reducing warpage in semiconductor packagesADVANCED SYSTEMS AUTOMATION LI·Filed 1997·Granted Jan 11, 2000·19 cites·14 claims
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