Assignee

ACER DISPLAY TECHNOLOGY

TW·1 granted patent·7 citations·filing 2001–2001

Technology mixH05K1 H10W1

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1 record

0152US6489573B2Electrode bonding structure for reducing the thermal expansion of the flexible printed circuit board during the bonding processACER DISPLAY TECHNOLOGY·Filed 2001·Granted Dec 3, 2002·7 cites·7 claims

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