Assignee
AALTOSEMI INC
CN·5 granted patents·24 pending applications·0 citations·filing 2023–2025
Top patents by PatentIndex Score
29 records- 0173US2026059658A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 0263US12550765B2Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2024·Granted Feb 10, 2026·0 cites·5 claims
- 0360US2026060106A1Package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 0457US12550796B2Electronic package and fabricating method thereofAALTOSEMI INC·Filed 2024·Granted Feb 10, 2026·0 cites·10 claims
- 0557US2025159800A1Package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 0656US12599003B2Manufacturing method of package substrateAALTOSEMI INC·Filed 2023·Granted Apr 7, 2026·0 cites·6 claims
- 0756US12550767B2Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2024·Granted Feb 10, 2026·0 cites·2 claims
- 0856US2024282590A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 0956US2024243048A1Electronic package, package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 1055US12557664B2Electronic package and fabricating method thereofAALTOSEMI INC·Filed 2024·Granted Feb 17, 2026·0 cites·2 claims
- 1155US2024213137A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 1254US2026026362A1Fabricating method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 1353US2026053033A1Package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 1453US2025014989A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 1552US2024096721A1Electronic package and manufacturing method thereofAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 1652US2025096105A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 1752US2024282683A1Electronic package, package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 1852US2023282556A1Substrate structureAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 1952US2025192014A1Electronic package and manufacturing method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 2051US2023290744A1Electronic package, package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 2150US2025323062A1Fabricating method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 2250US2024096776A1Package substrateAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 2348US2023298986A1Package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2023·Application pending·0 cites
- 2446US2025308935A1Method for fabricating a package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 2546US2025372400A1Fabricating method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 2644US2025308937A1Manufacturing method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 2743US2025300052A1Semiconductor package and fabricating method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 2842US2025246443A1Package substrate and manufacturing method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 2939US2025253261A1Electronic package and manufacturing method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when AALTOSEMI INC files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →