Assignee
YU CHEEMEN
US·2 granted patents·3 pending applications·8 citations·filing 2007–2007
Top patents by PatentIndex Score
5 records- 0177US8395246B2Two-sided die in a four-sided leadframe based packageYU CHEEMEN·Filed 2007·Granted Mar 12, 2013·8 cites·19 claims
- 0247US8058099B2Method of fabricating a two-sided die in a four-sided leadframe based packageYU CHEEMEN·Filed 2007·Granted Nov 15, 2011·0 cites·17 claims
- 0342US2008305306A1Semiconductor molded panel having reduced warpageYU CHEEMEN·Filed 2007·Application pending·0 cites
- 0442US2008305576A1Method of reducing warpage in semiconductor molded panelYU CHEEMEN·Filed 2007·Application pending·0 cites
- 0542US2009065902A1Method of forming a semiconductor die having a sloped edge for receiving an electrical connectorYU CHEEMEN·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when YU CHEEMEN files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →