Assignee
WU CHUNG-LIN
TW·3 granted patents·10 citations·filing 2011–2012
Top patents by PatentIndex Score
3 records- 0181US8723300B2Multi-chip module power clipWU CHUNG-LIN·Filed 2012·Granted May 13, 2014·7 cites·21 claims
- 0274US8278742B2Thermal enhanced upper and dual heat sink exposed molded leadless package and methodWU CHUNG-LIN·Filed 2011·Granted Oct 2, 2012·3 cites·4 claims
- 0341US9378130B2Data writing method, and memory controller and memory storage apparatus using the sameWU CHUNG-LIN·Filed 2012·Granted Jun 28, 2016·0 cites·21 claims
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