Assignee
WORLD WISER ELECTRONICS INC
US·7 granted patents·337 citations·filing 1998–1999
Top patents by PatentIndex Score
7 records- 0186US6201300B1Printed circuit board with thermal conductive structureWORLD WISER ELECTRONICS INC·Filed 1998·Granted Mar 13, 2001·113 cites·31 claims
- 0284US6175497B1Thermal vias-provided cavity-down IC package structureWORLD WISER ELECTRONICS INC·Filed 1999·Granted Jan 16, 2001·114 cites·9 claims
- 0377US6326240B1Apparatus for packaging semiconductor device and method for packaging the sameWORLD WISER ELECTRONICS INC·Filed 1999·Granted Dec 4, 2001·44 cites·17 claims
- 0464US6032355AMethod of forming thermal conductive structure on printed circuit boardWORLD WISER ELECTRONICS INC·Filed 1998·Granted Mar 7, 2000·30 cites·31 claims
- 0556US6264862B1Method for manufacturing a plugWORLD WISER ELECTRONICS INC·Filed 1999·Granted Jul 24, 2001·18 cites·13 claims
- 0646US6115911AMethod of manufacturing a plugWORLD WISER ELECTRONICS INC·Filed 1999·Granted Sep 12, 2000·11 cites·8 claims
- 0733US6270620B1Etching deviceWORLD WISER ELECTRONICS INC·Filed 1999·Granted Aug 7, 2001·7 cites·18 claims
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