Assignee
UNITED MICORELECTRONICS CORP
TW·2 granted patents·64 citations·filing 1997–2002
Top patents by PatentIndex Score
2 records- 0190US6917109B2Air gap structure and formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit deviceUNITED MICORELECTRONICS CORP·Filed 2002·Granted Jul 12, 2005·61 cites·20 claims
- 0230US5959331AHigh density transistor component and its manufacturing methodUNITED MICORELECTRONICS CORP·Filed 1997·Granted Sep 28, 1999·3 cites·5 claims
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