Assignee
UMC JAPAN
JP·19 granted patents·5 pending applications·78 citations·filing 2002–2006
Top patents by PatentIndex Score
24 records- 0171US6577547B2Semiconductor memory deviceUMC JAPAN·Filed 2002·Granted Jun 10, 2003·35 cites·4 claims
- 0259US7924042B2Semiconductor device, and design method, inspection method, and design program thereforUMC JAPAN·Filed 2006·Granted Apr 12, 2011·3 cites·4 claims
- 0358US6774652B2Cantilever type probe card and method for production thereofUMC JAPAN·Filed 2003·Granted Aug 10, 2004·11 cites·4 claims
- 0450US7103864B2Semiconductor device, and design method, inspection method, and design program thereforUMC JAPAN·Filed 2003·Granted Sep 5, 2006·5 cites·3 claims
- 0550US6627936B2Semiconductor device and method of producing the sameUMC JAPAN·Filed 2002·Granted Sep 30, 2003·4 cites·1 claims
- 0649US6753240B2Semiconductor device production methodUMC JAPAN·Filed 2002·Granted Jun 22, 2004·5 cites·16 claims
- 0747US7279923B2LSI inspection method and defect inspection data analysis apparatusUMC JAPAN·Filed 2006·Granted Oct 9, 2007·0 cites·2 claims
- 0847US6894389B2Semiconductor device and manufacturing method thereforUMC JAPAN·Filed 2003·Granted May 17, 2005·4 cites·1 claims
- 0945US6881656B1Production process for semiconductor apparatusUMC JAPAN·Filed 2002·Granted Apr 19, 2005·2 cites·12 claims
- 1043US6656816B2Method for manufacturing semiconductor deviceUMC JAPAN·Filed 2002·Granted Dec 2, 2003·1 cites·16 claims
- 1143US2004031005A1Electronic cad system and layout data producing method thereforUMC JAPAN·Filed 2003·Application pending·0 cites
- 1241US7199460B2Semiconductor device and method of manufacturing the sameUMC JAPAN·Filed 2003·Granted Apr 3, 2007·2 cites·16 claims
- 1341US2006231779A1Exterior inspection apparatus and exterior inspection methodUMC JAPAN·Filed 2006·Application pending·0 cites
- 1439US7123041B2LSI inspection method and defect inspection data analysis apparatusUMC JAPAN·Filed 2004·Granted Oct 17, 2006·0 cites·3 claims
- 1539US7076747B2Analytical simulator and analytical simulation method and programUMC JAPAN·Filed 2002·Granted Jul 11, 2006·2 cites·8 claims
- 1639US6959485B2Bump ball crimping apparatusUMC JAPAN·Filed 2003·Granted Nov 1, 2005·2 cites·14 claims
- 1738US7223682B2Method of making a semiconductor device using bump material including a liquidUMC JAPAN·Filed 2004·Granted May 29, 2007·0 cites·6 claims
- 1837US6797997B2Semiconductor memory apparatusUMC JAPAN·Filed 2003·Granted Sep 28, 2004·2 cites·18 claims
- 1936US7074526B2Photomask covered with light-transmissive and electrically-conductive polymer materialUMC JAPAN·Filed 2003·Granted Jul 11, 2006·0 cites·9 claims
- 2035US6653854B2Test pin unitUMC JAPAN·Filed 2002·Granted Nov 25, 2003·0 cites·12 claims
- 2133US2003159274A1Bump forming system employing attracting and compressing deviceUMC JAPAN·Filed 2003·Application pending·0 cites
- 2233US2003183931A1Semiconductor apparatus, fixture for measuring characteristics therefor, and semiconductor device characteristics measuring apparatusUMC JAPAN·Filed 2003·Application pending·0 cites
- 2331US6911387B2Bump forming method and apparatus for heating and compressing bump materials inserted in positioning holesUMC JAPAN·Filed 2003·Granted Jun 28, 2005·0 cites·8 claims
- 2431US2003087515A1Method for fabricating semiconductor deviceUMC JAPAN·Filed 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when UMC JAPAN files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →