Assignee
TSAI YAO-JUN
TW·5 granted patents·46 citations·filing 2009–2011
Top patents by PatentIndex Score
5 records- 0193US9178107B2Wafer-level light emitting diode structure, light emitting diode chip, and method for forming the sameTSAI YAO-JUN·Filed 2011·Granted Nov 3, 2015·15 cites·11 claims
- 0290US8759865B2Light emitting diode chip, light emitting diode package structure, and method for forming the sameTSAI YAO-JUN·Filed 2011·Granted Jun 24, 2014·13 cites·45 claims
- 0387US8193541B2Light emitting diode structure having a conductive thin film for connecting a light emitting stack to an electrode and LED packaging structure using the sameTSAI YAO-JUN·Filed 2010·Granted Jun 5, 2012·8 cites·40 claims
- 0474US8115218B2Light emitting diode package structure and method for fabricating the sameTSAI YAO-JUN·Filed 2009·Granted Feb 14, 2012·6 cites·20 claims
- 0571US8138518B2Light emitting diode, package structure and manufacturing method thereofTSAI YAO-JUN·Filed 2009·Granted Mar 20, 2012·4 cites·19 claims
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