Assignee
TESSERA INTERCONNECT MATERIALS INC
US·1 granted patent·1 pending application·16 citations·filing 2005–2012
Top patents by PatentIndex Score
2 records- 0183US7923828B2Structure and method of making interconnect element, and multilayer wiring board including the interconnect elementTESSERA INTERCONNECT MATERIALS INC·Filed 2005·Granted Apr 12, 2011·16 cites·12 claims
- 0251US2013119012A1Interconnection element for electric circuitsTESSERA INTERCONNECT MATERIALS INC·Filed 2012·Application pending·0 cites
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