Assignee
TAKEMURA KOJI
JP·5 granted patents·3 pending applications·14 citations·filing 2006–2012
Top patents by PatentIndex Score
8 records- 0177US8841753B2Semiconductor device having seal wiringTAKEMURA KOJI·Filed 2012·Granted Sep 23, 2014·4 cites·25 claims
- 0273US8164163B2Semiconductor device having sealing ringTAKEMURA KOJI·Filed 2008·Granted Apr 24, 2012·5 cites·27 claims
- 0370US8237281B2Semiconductor deviceTAKEMURA KOJI·Filed 2011·Granted Aug 7, 2012·2 cites·26 claims
- 0465US8102056B2Semiconductor device having pads and which minimizes defects due to bonding and probing processesTAKEMURA KOJI·Filed 2006·Granted Jan 24, 2012·3 cites·23 claims
- 0552US2009108410A1Semiconductor deviceTAKEMURA KOJI·Filed 2008·Application pending·0 cites
- 0647US8810039B2Semiconductor device having a pad and plurality of interconnectsTAKEMURA KOJI·Filed 2011·Granted Aug 19, 2014·0 cites·30 claims
- 0745US2012306915A1Display device, method of controlling display device, and recording mediumTAKEMURA KOJI·Filed 2012·Application pending·0 cites
- 0833US2012069211A1Image pickup device and method of arranging image pickup elementTAKEMURA KOJI·Filed 2010·Application pending·0 cites
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