Assignee
TAKAHASHI MICHIMASA
JP·26 granted patents·1 pending application·106 citations·filing 2007–2012
Top patents by PatentIndex Score
27 records- 0195US8071883B2Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the sameTAKAHASHI MICHIMASA·Filed 2007·Granted Dec 6, 2011·29 cites·24 claims
- 0287US8177577B2Printed wiring board having a substrate with higher conductor density inserted into a recess of another substrate with lower conductor densityTAKAHASHI MICHIMASA·Filed 2009·Granted May 15, 2012·14 cites·19 claims
- 0386US8479389B2Method of manufacturing a flex-rigid wiring boardTAKAHASHI MICHIMASA·Filed 2009·Granted Jul 9, 2013·10 cites·20 claims
- 0485US8609991B2Flex-rigid wiring board and method for manufacturing the sameTAKAHASHI MICHIMASA·Filed 2009·Granted Dec 17, 2013·10 cites·16 claims
- 0582US8536457B2Multilayer wiring board and method for manufacturing the sameTAKAHASHI MICHIMASA·Filed 2009·Granted Sep 17, 2013·8 cites·15 claims
- 0682US8405999B2Flexible wiring board and method of manufacturing sameTAKAHASHI MICHIMASA·Filed 2009·Granted Mar 26, 2013·8 cites·25 claims
- 0782US8178789B2Wiring board and method of manufacturing wiring boardTAKAHASHI MICHIMASA·Filed 2008·Granted May 15, 2012·8 cites·34 claims
- 0880US8481424B2Multilayer printed wiring boardTAKAHASHI MICHIMASA·Filed 2011·Granted Jul 9, 2013·4 cites·20 claims
- 0980US8212363B2Multilayer printed wiring boardTAKAHASHI MICHIMASA·Filed 2010·Granted Jul 3, 2012·4 cites·20 claims
- 1078US9040837B2Wiring board and method for manufacturing the sameTAKAHASHI MICHIMASA·Filed 2012·Granted May 26, 2015·4 cites·24 claims
- 1176US8476531B2Flex-rigid wiring board and method of manufacturing the sameTAKAHASHI MICHIMASA·Filed 2011·Granted Jul 2, 2013·2 cites·10 claims
- 1275US8431829B2Printed wiring board and method for manufacturing the sameTAKAHASHI MICHIMASA·Filed 2009·Granted Apr 30, 2013·5 cites·20 claims
- 1358US8921705B2Wiring board and fabrication method thereforTAKAHASHI MICHIMASA·Filed 2009·Granted Dec 30, 2014·0 cites·18 claims
- 1457US8621748B2Manufacturing method for a printed wiring boardTAKAHASHI MICHIMASA·Filed 2009·Granted Jan 7, 2014·0 cites·20 claims
- 1556US9084381B2Method for manufacturing flex-rigid wiring boardTAKAHASHI MICHIMASA·Filed 2011·Granted Jul 14, 2015·0 cites·20 claims
- 1656US8925194B2Flex-rigid wiring board and method of manufacturing the sameTAKAHASHI MICHIMASA·Filed 2011·Granted Jan 6, 2015·0 cites·20 claims
- 1756US8648263B2Wiring board and method of manufacturing wiring boardTAKAHASHI MICHIMASA·Filed 2008·Granted Feb 11, 2014·0 cites·29 claims
- 1856US8525038B2Flex-rigid wiring board and method of manufacturing the sameTAKAHASHI MICHIMASA·Filed 2011·Granted Sep 3, 2013·0 cites·14 claims
- 1955US8677612B2Method for manufacturing flex-rigid wiring boardTAKAHASHI MICHIMASA·Filed 2011·Granted Mar 25, 2014·0 cites·20 claims
- 2055US8669480B2Wiring board and method of manufacturing wiring boardTAKAHASHI MICHIMASA·Filed 2008·Granted Mar 11, 2014·0 cites·28 claims
- 2155US8522429B2Method of manufacturing wiring boardTAKAHASHI MICHIMASA·Filed 2011·Granted Sep 3, 2013·0 cites·13 claims
- 2254US9271405B2Flex-rigid wiring board and method of manufacturing the sameTAKAHASHI MICHIMASA·Filed 2012·Granted Feb 23, 2016·0 cites·20 claims
- 2354US2011283532A1Flexible wiring board and method of manufacturing sameTAKAHASHI MICHIMASA·Filed 2011·Application pending·0 cites
- 2453US8181341B2Method of forming a multilayer printed wiring board having a bulged viaTAKAHASHI MICHIMASA·Filed 2009·Granted May 22, 2012·0 cites·18 claims
- 2552US8399775B2Flex-rigid wiring board and method of manufacturing the sameTAKAHASHI MICHIMASA·Filed 2009·Granted Mar 19, 2013·0 cites·20 claims
- 2651US9215811B2Method for manufacturing multi-piece substrate and multi-piece substrateTAKAHASHI MICHIMASA·Filed 2012·Granted Dec 15, 2015·0 cites·20 claims
- 2751US8513539B2Wiring board and method of manufacturing the sameTAKAHASHI MICHIMASA·Filed 2011·Granted Aug 20, 2013·0 cites·29 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →