Assignee
TAKADA TOMOYUKI
JP·6 granted patents·1 pending application·6 citations·filing 2008–2012
Top patents by PatentIndex Score
7 records- 0166US8716836B2Semiconductor wafer, semiconductor wafer manufacturing method, and electronic deviceTAKADA TOMOYUKI·Filed 2008·Granted May 6, 2014·2 cites·34 claims
- 0262US8809908B2Semiconductor wafer, semiconductor wafer manufacturing method, and electronic deviceTAKADA TOMOYUKI·Filed 2008·Granted Aug 19, 2014·1 cites·45 claims
- 0361US8772830B2Semiconductor wafer including lattice matched or pseudo-lattice matched buffer and GE layers, and electronic deviceTAKADA TOMOYUKI·Filed 2008·Granted Jul 8, 2014·1 cites·17 claims
- 0461US8311235B2Communication control method, communication system and computer programTAKADA TOMOYUKI·Filed 2009·Granted Nov 13, 2012·2 cites·12 claims
- 0549US8709904B2Method for producing semiconductor substrate, semiconductor substrate, method for manufacturing electronic device, and reaction apparatusTAKADA TOMOYUKI·Filed 2009·Granted Apr 29, 2014·0 cites·21 claims
- 0639US8823141B2Semiconductor wafer, method of producing semiconductor wafer, electronic device, and method of producing electronic deviceTAKADA TOMOYUKI·Filed 2010·Granted Sep 2, 2014·0 cites·18 claims
- 0739US2012319171A1Semiconductor wafer, semiconductor device, and a method of producing a semiconductor waferTAKADA TOMOYUKI·Filed 2012·Application pending·0 cites
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