Assignee
SKIILEUX ELECTRICITY INC
TW·7 granted patents·11 pending applications·2 citations·filing 2019–2024
Top patents by PatentIndex Score
18 records- 0169US11222829B2Electronic device mounting structure and mounting device to mount such electronic deviceSKIILEUX ELECTRICITY INC·Filed 2019·Granted Jan 11, 2022·1 cites·15 claims
- 0268US11222833B2Micro-heaters in a film structure mounted on a substrate between a plurality of electronic componentsSKIILEUX ELECTRICITY INC·Filed 2019·Granted Jan 11, 2022·1 cites·20 claims
- 0368US2024308200A1Device for transferring electronic component and method for transferring electronic componentSKIILEUX ELECTRICITY INC·Filed 2024·Application pending·0 cites
- 0464US2023158608A1Equipment and method for cutting substrateSKIILEUX ELECTRICITY INC·Filed 2022·Application pending·0 cites
- 0561US12132153B2LED package structure and method of manufacturing the same, and LED displaySKIILEUX ELECTRICITY INC·Filed 2021·Granted Oct 29, 2024·0 cites·12 claims
- 0660US2023068211A1Device for transferring electronic component and method for transferring electronic componentSKIILEUX ELECTRICITY INC·Filed 2022·Application pending·0 cites
- 0758US12087742B2Film pattern and methods for forming the sameSKIILEUX ELECTRICITY INC·Filed 2021·Granted Sep 10, 2024·0 cites·15 claims
- 0858US11956887B2Board, circuit board, and fixtureSKIILEUX ELECTRICITY INC·Filed 2022·Granted Apr 9, 2024·0 cites·13 claims
- 0958US2022135872A1Optical wavelength conversion composite material, related manufacturing method and related optical wavelength conversion composite structureSKIILEUX ELECTRICITY INC·Filed 2021·Application pending·0 cites
- 1054US2022259489A1Light conversion composite material assembly and method of manufacturing a light conversion composite material assemblySKIILEUX ELECTRICITY INC·Filed 2021·Application pending·0 cites
- 1152US11355407B2Micro heater chip, wafer-level electronic chip assembly and chip assembly stacking systemSKIILEUX ELECTRICITY INC·Filed 2020·Granted Jun 7, 2022·0 cites·10 claims
- 1252US2022017817A1Quantum dot composite material and manufacturing method thereof, and led package structureSKIILEUX ELECTRICITY INC·Filed 2021·Application pending·0 cites
- 1351US2023121505A1Electronic device, electronic element soldering method and light-emitting diode display manufacturing methodSKIILEUX ELECTRICITY INC·Filed 2022·Application pending·0 cites
- 1450US2022246788A1Film coating method and light-emitting deviceSKIILEUX ELECTRICITY INC·Filed 2021·Application pending·0 cites
- 1549US2022093557A1Chip-transferring system and chip-transferring methodSKIILEUX ELECTRICITY INC·Filed 2021·Application pending·0 cites
- 1648US12125719B2Chip-transferring system and chip-transferring methodSKIILEUX ELECTRICITY INC·Filed 2021·Granted Oct 22, 2024·0 cites·9 claims
- 1746US2022020723A1Chip-carrying structure and chip-bonding methodSKIILEUX ELECTRICITY INC·Filed 2021·Application pending·0 cites
- 1844US2022322519A1Board and circuit boardSKIILEUX ELECTRICITY INC·Filed 2021·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →