Assignee
SIPLP MICROELECTRONICS CHONGQING LTD
CN·0 granted patents·6 pending applications·0 citations·filing 2022–2023
Top patents by PatentIndex Score
6 records- 0153US2024321846A1Semiconductor package method and semiconductor package structureSIPLP MICROELECTRONICS CHONGQING LTD·Filed 2022·Application pending·0 cites
- 0242US2025015022A1Fabrication method for semiconductor structure and semiconductor structureSIPLP MICROELECTRONICS CHONGQING LTD·Filed 2022·Application pending·0 cites
- 0336US2024087912A1Semiconductor packaging methodSIPLP MICROELECTRONICS CHONGQING LTD·Filed 2022·Application pending·0 cites
- 0436US2025329550A1Panel-level packaging method for semiconductor structureSIPLP MICROELECTRONICS CHONGQING LTD·Filed 2023·Application pending·0 cites
- 0536US2024203922A1Semiconductor packaging method and semiconductor packaging structureSIPLP MICROELECTRONICS CHONGQING LTD·Filed 2022·Application pending·0 cites
- 0636US2024274501A1Mcm package structure and manufacturing method thereforSIPLP MICROELECTRONICS CHONGQING LTD·Filed 2022·Application pending·0 cites
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