Assignee
SIPLP MICROELECTRONICS CHONGQING CO LTD
CN·0 granted patents·2 pending applications·0 citations·filing 2021–2021
Top patents by PatentIndex Score
2 records- 0151US2023170318A1Semiconductor packaging method and semiconductor packaging structureSIPLP MICROELECTRONICS CHONGQING CO LTD·Filed 2021·Application pending·0 cites
- 0234US2023268299A1Die and manufacturing method therefor, and chip packaging structure and manufacturing method thereforSIPLP MICROELECTRONICS CHONGQING CO LTD·Filed 2021·Application pending·0 cites
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